The AOTL66518 and AOB66518L MOSFETs are supplied in a TOLL package, which has a footprint 30% smaller than a conventional TO-263 (D2PAK) option. In additon to the space savings, the MOSFETs also have low on-resistance and a maximum junction temperature of up to 175°C. To protect the load and ensure reliable operation, the MOSFETs limit high in-rush currents in soft-start, eFuse and other hot swap conditions.
The TOLL package is designed to reduce the number of MOSFETs used in parallel in telecomms designs. Its clip technology ensures a higher current capability with the AOTL66518, for example, exhibiting a very low thermal resistance from silicon junction to the bottom of the package case (Rthjc) compared to a device in a TO-263 package.
The reliable, robust linear mode performance MOSFETs meet the demanding requirements of telecomms applications, with high SOA and low on-resistance, says AOS.
The AOTL66518 and AOB66518L are immediately available in production quantities with a lead-time of 16 weeks.