The material easily adapts to the differing thicknesses of components on the PCB and fills the gaps between hot electronic components and metal casings or cooling components.
WE-TGF is made of silicone incorporating ceramic particles. For applications in which the PCB is screwed onto a metal plate, the material is also reinforced with a glass-fibre mesh. The thermoconductive gap filler is suited for use e.g. in power electronics, entertainment technology, or in networking devices.
WE-TGF is available ex stock in a variety of dimensions and in thicknesses ranging from 0.23 to 5mm. Developers working in the prototype construction area can request individually cut samples, which are shipped within 48 hours of ordering. Customization comes at no extra charge for the customer.
