The R7FS5D37A3A01CFP Synergy MCU is supplied in a 100-pin LQFP package and is scalable up through the S5D5, S5D9 and S7G2 MCU groups if additional features, memory, or higher performance is later required.
Together with its associated TB-S5D3 Target Board Kit, the R7FS5D37A3A01CFP Synergy MCU is suitable for a diverse range of applications including industrial automation, building automation, office automation, as well as smart metering and other control-based use cases.
The MCU and target board address cost-sensitive applications that do not require on-chip graphics acceleration or Ethernet connectivity, but do require a high-performance MCU.
The R7FS5D37A3A01CFP and TB-S5D3 integrate a 120MHz Arm Cortex-M4F processor core and advanced security, along with 512-KB of flash memory and 256-KB of SRAM.
The S5D3 MCU Group is based on a highly efficient 40nm process technology and is fully supported by the Synergy Software Package (SSP), which enables a seamless transition for design and development engineers between the various Synergy MCUs.
The TB-S5D3 Target Board Kit’s set of features is highly comparable to the existing TB-S5D5 Target Board Kit, including an identical form factor to other boards in the S5 Series.
The board’s feature-set include pin-headers that provide access to all of the MCU’s signals; easy debugging via the on-board Segger J-Link debugger; a selection of expansion connectivity options, including USB and Pmod connectors, enabling easy connection to many different baseboards; and HMI functionality including user LEDs and touch buttons including a capacitive touch sensing unit.
The Renesas R7FS5D37A3A01CFP Synergy MCU and TB-S5D3 Target Board Kit are shipping now from RS in the EMEA and Asia Pacific regions.
