This rapid adoption of a technology is not without its drawbacks. As performance has increased – increased power, increased flexibility and increased speed – the long-term reliability of the port has decreased when compared to the previous standard, the Micro-B 5 Pin. This decrease in reliability relates to both the increased density of pin arrangement and changes in manufacturing methods. The combination of new design and new production techniques has led to inherent problems with some USB-C ports.
The increase in pin density, owing to the ports reversible design, has placed sensitive pins closer to each other, increasing the risk of shorts and therefore corrosion when it accidentally comes into contact with water. Damage of this type exhibits itself as devices failing to charge, the inability to transfer data or slowed performance. These issues can be short term until the moisture is removed, or more permanent if corrosion occurs at the point of contamination.
While there is no way to combat short-term functionality issues due to shorts created by the presence of water, there are two approaches which can combat long-term functionality damage – the use of high-grade gold covering all active electrical contacts, or the use of an electrically insulating nano coating post-manufacture.
You can read more in the whitepaper below.
