Through experimentation the optimal ratio was determined where neither destruction of the ceramic, nor material leakage occurred.
After measurement, the package was shown capable of withstanding 50 hours of short-circuit failure mode (SCFM). The experiment was executed with one shorted IEGT chip, out of 42 IEGT chips, in a worse-case edge location.
In addition, the rupture resistance tests, undertaken at a 3200V test condition, resulted in 1.7 times higher resistance than that of standard PPI devices.
The outcomes of the research will be presented at the PCIM Europe 2018 Conference by Raita Kotani and Georges Tchouangue on Thursday, 7th June at 11:15.
