Indium Corporation is redefining solder with its InFORMS solder preforms. InFORMS are a composite preform consisting of solder and a reinforcing matrix. Together, lateral strength is increased and bondline co-planarity is improved. In addition, superior thermal cycling reliability can be achieved.
When InFORMS were used to solder a DBC to the baseplate of an IGBT, one study showed:
- Four improved thermal cycling reliability compared to a solder preform-only approach
- Two improved thermal cycling reliability compared to a solder preform + Al wirebond stitch approach
- Reduced voiding (<1%)
- Lower cost of ownership – as a drop-in replacement for a standard preform or solder paste, InFORMS require no additional process steps or equipment
Click here for more information about InFORMS.