The products will be showcased at ATP’s booth in hall 1, booth 1-655.
Benefits of 3D NAND compared to planar NAND
Higher memory capacity:
By stacking more layers vertically, greater capacities, such as 1, 1.5 and 2TB, are made possible through 3D NAND.
Lower cost per bit:
Compared to planar NAND, 3D NAND shows greater cost advantage as the capacity increases.
Increased longevity and supply flexibility through ATP’s die packaging:
The high end manufacturing facility is capable of processing NAND wafer dies into ATP’s own SDP, DDP, QDP or ODP BGA packages. This simplifies supply chain planning and results in higher flexibility and better lead times. At the same time, it allows the company to offer better longevity for its products through extended wafer supply agreements with its manufacturers.