Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will deliver the keynote address, The Future of Power Device Packaging: Materials and Assembly Processes.
Dr. Ning-Cheng Lee, Vice President of Technology, will lead a short course. Achieving High Reliability for Lead-Free Solder Joints will explore the detailed material considerations required for achieving high reliability in lead-free solder joints. Topics will include understanding the factors related to various failure modes and how to select proper solder alloys and surface finishes.
Sze Pei Lim, Semiconductor Product Manager – Asia, will present No-Clean Materials for Advanced Packaging Assembly, which details how semiconductor-grade, ultra-low residue, no-clean fluxes and solder pastes eliminate the need for multiple cleaning steps in the flip-chip, as well as in system-in-package (SiP) assembly processes. Ultra-low residue no-clean fluxes help to Avoid the Void by reducing the flux residue left behind after soldering, thereby decreasing the danger of delamination.