Engineered Material Systems will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at Intersolar North America (July 12-14) in San Francisco. The 561-400 series is designed for stringing and shingling crystalline silicon and heterojunction solar modules.
The EMS 561-400 series is designed to be used in modified ribbon stringers. The material will snap cure and fixture ribbons in seconds at 150°C with enough strength to withstand module manufacturing processes until the adhesive cure is completed during the encapsulant lamination process. EMS 561-400 series conductive adhesives can be dispensed by time-pressure, auger or jetting.
The adhesive is more stress absorbing than solder to withstand the rigors of thermal cycling and processes at lower temperatures than solder. EMS 561-400 series conductive adhesives are 60 percent less expensive than pure silver-filled conductive adhesives.
