Silicone-free thermal interface material approved for power modules

Vincotech has announced the approval of silicone-free of Müller-Ahlhorn Thermigrease TG 20032 for the company’s power modules. MiniSKiiP modules are the first to ship with this pre-applied silicone-free thermal paste. Many applications, for example, automotive production lines, have severe requirements regarding silicone-free products.

Responding to rising demand for silicone-free thermal paste, Vincotech recently investigated such materials for their technical and commercial viability and then qualified and approved Müller-Ahlhorn Thermigrease TG 20032 for the company’s power modules.

MiniSKiiP modules are the first to ship with this pre-applied silicone-free thermal paste, with other Vincotech product families soon. General features of pre-applied TIM include thermal conducting material with optimized thickness, optimised thermal resistance, streamlined production process; no need for screen printing facilities and automated screen printing for utmost precision and reliability.

Keep Up to Date with the Most Important News

By pressing the Subscribe button, you confirm that you have read and are agreeing to our Privacy Policy and Terms of Use
Previous Post

Advanced microwave products for EW/ECM systems

Next Post

CEVA imaging & vision DSP powers image processing LSI chips