Essemtec AG will showcase a machine with the ability to stack components and subassemblies and join them with jetted solder paste or glue. This platform combines multiple process sequences to create complex micro devices, MEMS sensors, microwave assemblies and over- moulded lead frame components.
Essemtec will also demonstrate a work cell comprised of a pick-and-place machine with integrated jet printing capability, a reflow oven and the Cubus SMT storage tower. Accurate inventory numbers and cost savings are achieved with seamless networked data integration. With this modest investment companies have the ability to rapidly test out new designs and produce small batches efficiently