By combining its extensive 2D AOI and 3D SPI experience with new proprietary technologies, the K Series delivers highly accurate all-around defect coverage including lifted components, lifted leads, tombstones, etc., for components up to 25 mm in height. Coupling high quality telecentric 2D images with dual camera blue-laser-based 3D profiles guarantees superior inspection quality for both pre-reflow and post-reflow.
K Series is also available as a cost-effective 3D AOI upgrade to existing 5K, 7K, and 9K systems. Associated with 3D SPI – PI Series – and interconnected with SIGMA Link software suite, this whole 3D inspection solution is designed to satisfy the requirements of the most demanding PCB manufacturers excelling in the automotive, aerospace and defense sectors.