Abstracts can be submitted for various topic areas defined by the conference committee, chaired by Prof. Dr. Klaus-Dieter Lang of Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin:
- Interconnection technology;
- Reliability and quality of PCBs;
- Process optimisation and traceability, competitiveness;
- New materials, materials development & material efficiency;
- Assembly of electronic components;
- Packaging and system integration;
- Power electronics and high temperature PCB;
- 3D integration technologies;
- Design and development tools;
- Printed electronics;
- Manufacturing logistics, equipment optimisation and Overall Equipment Effectiveness (OEE);
- Power LED systems and photonic boards;
- Environment, energy efficiency & disposal;
- Flex and rigid-flex PCB;
- Panel level packaging; and
- Component standardisation.