During productronica 2015, the SMART Group will support the “Solder Paste and Solder Joint Automatic Inspection Experience.” in Hall 4 where the SMART Group and NPL will participate in a comprehensive programme that will include live printing, ultra-fine pitch deposits, 0201 and 01005 devices, inspection and measurement of different combinations of materials, plus some of the key in-process inspection steps to make a process perform correctly.
Additionally, the feature will include AOI inspection of printed board assemblies for open joints, lifted leads, partial lifting of passives and other less common defects. A series of test boards has been specially created with known process defects to show the machines’ capabilities. The feature is being organised by Bob Willis.