The assemblies take up as little as 15 mm of board space, with one micro SFP+ connector freeing up to 19 percent more faceplate space than a single SPF+ connector. The cable assembly and connector provide a staggered contact configuration that helps improve signal routing, and the 22-position connector supports data rates up to 10Gbps.
The integrated connector and cage with solder tail is designed for one-step board placement, and the connector can withstand up to 265 degrees Celsius for high-temperature pin-in-paste soldering. The AWG 26 cable features a 360-degree braid crimp and an extended shield to minimise EMI.
TE’s micro SFP+ connector and cable assemblies are electrically compliant to SFF-8431 and support a number of protocols including 10 Gigabit Ethernet, Gigabit Ethernet, and Fibre Channel over Ethernet (FCoE). The micro SFP+ interconnects are designed for telecommunications, data communication, medical diagnostic equipment, and networking applications.