“This license agreement with Sony is an exciting milestone for Ziptronix, because it removes any doubt that our patented DBI hybrid bonding technology is both manufacturable and beneficial for high volume applications,” noted Dan Donabedian, CEO/President, Ziptronix.
“We believe it demonstrates that our patented hybrid bonding technology is both enabling and cost effective, as compared to stacking with TSVs. Sony licensed Ziptronix’s ZiBond direct bonding patents in 2011, which we also believe grew their image sensor market share from a few percent to the largest market share in the industry. We expect this license for Ziptronix’s DBI hybrid bonding patents will further contribute to Sony’s growth within the industry. Any company wishing to compete in this space will need Ziptronix’s DBI hybrid bonding patents.”