For processes where reflow soldering is the component assembly method, tin/lead solder terminations are necessary. In such situations, gold terminations require additional processing to pre-tin the terminations prior to assembly in order to prevent gold embrittlement.
The MLRF0603 and MLRF0805 series are designed for RF applications in military, aerospace and defence sectors. These applications include communication, guidance and security applications, as well as in radar, test and evaluation and special mission applications.