The acquisition represents a major step in SHENMAO’s strategic expansion into the advanced semiconductor and IC packaging market.
This milestone enhances SHENMAO’s vertical integration and reinforces its role as a key innovator and supplier for the growing global semiconductor ecosystem.
Founded in 2004, PMTC specialises in the development and manufacturing of high-end solder balls used in advanced packaging formats such as FCCSP (Flip Chip Chip Scale Packaging) and WLCSP (Wafer Level Chip Scale Packaging). PMTC is recognised worldwide by major IC design houses and packaging companies for its patented, high-reliability solder alloys that offer excellent ductility, thermal fatigue resistance, and drop performance.
The company brings in-house alloy development, application expertise, and a strong R&D foundation, positioning SHENMAO to accelerate innovation in semiconductor solder materials.
“The addition of PMTC to the SHENMAO Group gives us deeper access to the advanced packaging supply chain and adds new capacity, talent, and innovation in solder ball technology,” said Kelvin Li, General Manager of SHENMAO Group. “Together, we are committed to delivering high-performance materials for next-generation semiconductor applications.”
As part of its extended focus on eco-conscious and high-reliability materials, PMTC has introduced a new patented low-temperature solder alloy, E4 (Sn47.875Bi+Ag+Cu+In+Ni), designed for temperature-sensitive assemblies and carbon-reducing manufacturing environments.
