The event is scheduled to take place 22–24 October 2024 at the Donald E. Stephens Convention Center in Rosemont, Illinois.
The SMT industry has long faced challenges with the degradation and disintegration of stencil coatings caused by various cleaning solutions, squeegee pressures, and manufacturing processes. Recognising these issues, StenTech has developed a coating that overcomes these obstacles without requiring changes to established processes.
The StenTech BluPrint vapor deposition coating technique, a solution that is virtually indestructible and consistently delivers high-quality results across different SMT lines, especially in high-volume printing. This exclusive coating allows engineers to design PCBs with area ratios significantly below 0.6, increasing surface area for components. This advancement leads to less frequent cleaning, with some contract manufacturers experiencing a 50% boost in efficiency, cleaning once every four prints instead of every two, and others seeing up to a 67% efficiency increase by cleaning once every six prints. Additionally, the coating enhances transfer efficiency from 84% to 98%.
StenTech BluPrint is designed to enhance existing manufacturing processes, making them more efficient and cost-effective. This results in reduced quality control time, as the company’s stencils ensure that fully assembled PCBs are more likely to pass inspection. From the first print to the 50,000th, StenTech stencils maintain their integrity, eliminating bottlenecks in the initial steps of PCB assembly.
Visit Booth 3025 at SMTA International.