COM-HPC establishes itself as the most scalable Computer-on-Module (CoM) standard, covering a wide range of applications from small form factor designs to edge server designs. This simplifies the design-in process and enables the creation of complete product families with reduced engineering efforts. COM-HPC modules support not only specific processors like x86 or Arm but also FPGAs, ASICS, and AI accelerators, making it a comprehensive standard for developing innovative applications based on the latest embedded and edge data processing technologies.
Christian Eder, Chairman of PICMG’s COM-HPC Working Group and Director of Market Intelligence at congatec, expresses his enthusiasm for the COM-HPC standard: “COM-HPC offers the highest performance, bandwidth, interfaces, and scalability compared to other computer-on-module standards and with COM-HPC Mini, engineers can now leverage all this on a real small form factor for space constrained embedded and edge computing designs.”
congatec is committed to supporting the adoption and implementation of the COM-HPC Mini specification, enabling customers to bring their solutions to market quickly. As a leading provider of embedded computing solutions, congatec also continues to develop and deliver products that align with the latest industry standards.