The company will showcase three innovative products designed to meet current and future SMT challenges. New solutions are needed to meet the increasing demands for miniaturisation, reliability and TCO challenges.
Heraeus will introduce the next evolution of Solder Paste to address these challenges during the IPC APEX EXPO.
The all-new paste system is a high- reliability, performance paste system with a competitive TCO offering. Based on proven experience of Heraeus Electronics, the new paste system allows a wide process window, enabling soldering in air with low defects. Additionally, it is designed to offer an optimised formulation for lower material costs.
Moreover, the company will discuss its Innolot Solder Paste and mAgic DA320 Sinter Paste.
Heraeus’ SMT 650 Innolot solder paste achieves a consistently high surface insulation resistance that prevents electrochemical migration. The combination of the flux system with Innolot alloy delivers superior reliability – especially in miniaturised systems in the automotive industry. In addition, the developed flux system can also be combined with SAC305.
mAgic DA320 is a high shear strength, non-pressure dispensing sinter paste for die attach of power applications. With high thermal conductivity, it offers fast sintering at low application temperatures from 200°C and above to form quality interconnections.
For more information about the company’s innovative materials portfolio, visit Heraeus experts at the IPC APEX EXPO.
