Texas Instruments (TI) has expanded its industrial communications portfolio with two new devices designed to help manufacturers connect increasingly complex factory automation systems, robotics and Industrial Internet of Things (IIoT) equipment.
The new multiprotocol communications system-on-module (SoM) and dual-channel IO-Link master are designed to improve data exchange between factory control systems, sensors and other field devices, while reducing the hardware and development work required to support different industrial networking standards.
As factories become more connected, manufacturers increasingly need equipment from different suppliers to communicate reliably across multiple networks. However, supporting different industrial protocols has traditionally required separate hardware and software configurations, adding to system costs and design complexity.
TI’s latest products aim to address this by allowing engineers to support multiple established communication protocols through a common hardware platform.
The TICS100MOD multiprotocol communications module is built around TI’s AM2612 microcontroller and DP83826AI Ethernet physical layer. The company describes it as the industry’s smallest fully featured, certified communications SoM supporting multiple real-time Ethernet protocols on a single piece of hardware.
Engineers can switch between EtherCAT, EtherNet/IP and Profinet during system startup through a firmware update, removing the need for a hardware redesign when changing communication requirements.
The module incorporates two Arm Cortex-R5F processor cores and external memory to support industrial communication software and more demanding factory automation applications.
The second device, the TIOM2212 dual-channel IO-Link master, is designed to connect sensors and actuators to higher-level industrial networks.
Compatible with TI’s Sitara industrial networking system-on-chips and AM13Ex real-time microcontrollers, the device provides a connection between IO-Link field devices and factory control systems. Its integrated frame handler, analogue integration and protection features are intended to simplify system design while supporting reliable data transfer.
Karim Jamal, director of Industrial Communications Solutions at TI, said manufacturers needed greater flexibility as industrial communication standards and requirements continued to evolve.
“Industrial communication is evolving faster than ever, and engineers need a partner who can help them adapt to emerging standards and requirements,” he said.
“TI brings together certified hardware, software and in-house engineering expertise, supporting customers as they develop next-generation industrial automation systems that work together seamlessly across devices, networks and communication protocols.”
The technology is already being used in products from industrial sensor manufacturer SICK. Dr Stefan Odermatt, senior vice president of research and development, integrated automation at SICK, said TI’s Industrial Ethernet and IO-Link solutions had supported the development of products including the company’s SIG300.
The announcement reflects a wider industry focus on simplifying industrial connectivity as manufacturers adopt more connected production systems and seek to integrate equipment from different suppliers.
TI’s wider industrial communications offering combines programmable hardware with certified software stacks, development tools and application support. Its multiprotocol approach is designed to allow manufacturers to adapt to changing network requirements through software rather than replacing hardware.
A central part of the technology is TI’s programmable real-time unit and industrial communication subsystem (PRU-ICSS), which is integrated into its microcontrollers and system-on-chips. The dedicated hardware handles time-critical communications, freeing the main Arm processor cores to manage other system functions.
The addition of the TIOM2212 also extends TI’s IO-Link portfolio, giving the company hardware covering the main layers of the ecosystem, from transceivers and digital output switches to master devices with integrated frame handling.
TI will demonstrate its latest industrial communications technology at electronica 2026, taking place in Munich from 10 to 13 November.
The TICS100MOD module will feature in demonstrations at the company’s stand in Hall C4, Booth 159, showcasing multiprotocol Industrial Ethernet integration and developments in industrial networking, including IO-Link, time-sensitive networking and integrated neural processing units.
Further technical information about the TICS100MOD is available in TI’s application brief, Accelerating Industrial Connectivity: Simplifying Multiprotocol Ethernet Integration with TICS100MOD.
