Celebrating 70 years of innovation in Europe, Texas Instruments (TI) will demonstrate new technologies for building smarter, more efficient and more secure intelligent systems at electronica 10-13th November 2026 in Munich, Germany.
TI’s exhibit in hall C4, booth 159, will showcase how decades of design, system, and manufacturing expertise are enabling the company to continue innovating what’s next across embedded development, industrial automation, automotive electronics, and power infrastructure for AI.
Innovating what’s next in intelligent systems
TI will demonstrate how its analog and embedded processing semiconductors, software, and tool ecosystem enable innovation across key application areas:
- Accelerating embedded development: as embedded systems grow more complex, TI is enabling Agentic AI within its CCStudio development tool ecosystem and adding Zephyr RTOS support across its MCU, MPU and wireless portfolios to help engineers write and migrate code, configure systems, debug and deploy systems faster
- Transforming industrial automation: the shift toward physical AI in production environments requires increased reliability and deterministic control. TI provides these capabilities through a portfolio of real-time MCUs, GaN-based motor drivers, and multimodal sensing, alongside supporting multi-protocol industrial communication standards for next-generation automation
- Architecting intelligent vehicles: addressing the transition to AI-defined, zonal vehicle architectures, TI processors enable real-time sensor fusion and autonomous decision-making. Complementing this, TI’s scalable 12V and 48V architectures provide distributed power from driver assistance systems to chassis control
- Powering AI from grid to gate: today’s AI workloads are driving an increasing need for efficient power, networking and thermal management. TI is addressing this demand by enabling next-generation energy infrastructure with solid-state transformers, GaN-based AC/DC converters and battery management with integrated EIS. Additionally, TI’s complete 800V DC power solutions enable efficient and reliable AI data centres
TI speakers at electronica 2026:
- 10th November
- 10:00-10:20am CET: Heinz-Peter Beckemeyer presents ‘Future-proofing the Automotive Supply Chain Under the EU Cyber Resilience Act’ at the Cybersecurity Forum
- 10:35-11:15am CET: Artem Aginskiy participates in ‘Panel: Building the Embedded Platforms for Tomorrow’s Mobility: From Silicon to Software-Defined Vehicles’ at the Embedded Systems Forum
- 4:30-5:30pm. CET: Vinay Agarwal participates in ‘Roundtable: AI at the Edge for IIoT’ at the IIoT Forum
- 12th November
- 2:20-2:40pm CET: Marian Kost presents ‘Accelerating Embedded: How Open Source and AI Agents are Changing the Playing Field’ at the Embedded Developer Forum
- 13th November
- 12:50-1:15pm CET: Henrik Mannesson presents ‘Beyond the Iron Core: How Semiconductor Innovation Is Unlocking Next-Gen Grid Infrastructure’ at the Power Electronics Forum
Visit TI at booth 159:
- A full demo list with descriptions is available upon request.
- Interviews with TI experts are available upon request. Topic areas include:
- Embedded development and generative AI tools
- Physical AI, factory automation, and industrial communications
- AI-defined vehicles and automotive platforms
- Power infrastructure for AI data centres and the grid
- Cybersecurity and Cyber Resilience Act (CRA) readiness
- TI’s 70-year legacy in EMEA
- Product news announcements – additional details on embargoed news to come
