By extending the package size with the 3rd DCB substrate on the bottom side, it becomes the most powerful power module fitting for PCB design in the Infineon Easy module family. The advanced mechanical hold-down concept ensures a reliable pressing down force which ensures an optimum thermal management. On the top side, the flexible pin grid design supports a user-friendly PCB design with tremendous current capability and excellent dynamical electrical performance.
The Easy family is the best choice for customers who are looking for a flexible and scalable power module solution. Infineon offer the broadest base-plate-less package portfolio with 12 mm height. The flexible pin grid system is a perfect fit for customizing layout and pinout.
Visit Infineon at electronica, C3.502 and chat to the team about the cutting-edge 3-level power module.
Find more information about the product here: F3L600R10W4S7F_C22 | 950 V, 600 A 3-level IGBT module – Infineon Technologies
