With KIOXIA’s e-MMC memory solutions, Rutronik offers compact and powerful embedded components based on the BiCS FLASHTM generation 5 TLC 3D flash memory. The e-MMCs are available in 64 GB (THGAMSG9T15BAIL_TRAY / THGAMSG9T15BAIL_REEL) and 128GB (THGAMST0T25BAIL_TRAY / THGAMST0T25BAIL_REEL) and support the JEDEC e-MMC 5.1 protocol, operate with an I / O voltage of 1.8V and achieve transfer rates of up to 340 / s (read) and 230MB/s (write) in HS400 mode. The memory solutions are specified for a wide temperature range from -25 °C to +85 °C.
The KIOXIA e-MMC series combines state-of-the-art BiCS FLASHTM TLC 3D flash memory technology with an integrated controller and multi-chip architecture (MCP), enabling high data density with low power consumption. The modules are housed in a compact 153-ball BGA package (11.5× 13, 0.8 mm high) and offer full compatibility with existing host systems via the standardised MMC Version 5.1 interface (1-, 4- or 8-bit I / O).
With a read speed of 340 MB / s and a write speed of 230 MB / s in HS400 mode, the e-MMCs deliver significantly improved performance compared to the fourth generation – with stable operating characteristics even under load and at high temperatures.
Benefits at a glance:
- BiCS FLASHTM generation 5 TLC 3D flash memory
- JEDEC e-MMC 5.1 standard for broad compatibility
- High performance: up to 340 MB/s read / 230 MB/s write
- Extended temperature range (-25 to +85 °C)
- Integrated controller with ECC and wear levelling
- Low energy consumption thanks to 1.8V I / O voltage
- Stable performance during continuous operation and temperature changes
- Long-term availability and quality manufacturing from KIOXIA
Application examples:
- Industrial automation and control systems
- HMI and edge devices
- Smart home and IoT applications
- Digital cameras, wearables and portable devices
