Advanced Thermal Solutions has launched a new range of heat sinks designed to support NVIDIA’s Jetson Thor modules, as rising compute densities at the Edge place growing strain on conventional embedded cooling systems.
The Massachusetts-based thermal management specialist said the products are aimed at next-generation Edge computing, physical AI, and robotics applications, where sustained, high-power workloads are becoming the norm. The line includes both active and passive options, allowing system developers to select cooling solutions suited to different performance and airflow requirements.
One active model integrates a frameless fan directly into an aluminium fin array, enabling it to cool devices rated up to 95 W TDP at an ambient temperature of 50 °C. The unit measures 87 mm by 100.8 mm by 20 mm and weighs 104 g.
A second active design employs a top-mounted ATS blower and is intended for more demanding use cases. According to the company, it can dissipate heat from devices rated up to 175 W TDP at 50 °C. Including the blower, the heat sink measures 92 mm by 100.8 mm by 28.6 mm and weighs 174 g.
ATS has also introduced a passive aluminium heat sink capable of handling up to 100 W at 50 °C when paired with 500 LFM of system airflow. This model shares the same footprint as the smaller active unit, at 87 mm by 100.8 mm by 20 mm, and weighs 168 g.
All variants are supplied with a pre-assembled, high-performance thermal interface material, intended to improve heat transfer and simplify integration. The company said the products are engineered to maintain performance stability under continuous, high-power operation, allowing AI workloads to run at full capacity without thermal throttling.
NVIDIA’s Jetson Thor modules deliver up to 2,070 FP4 TFLOPS of AI compute and up to 128 GB of memory within a 40–130 W power envelope, positioning them for advanced robotics and physical AI deployments. ATS said it now offers cooling solutions across the full Jetson system-on-module portfolio.
