ROHM has begun mass production of a new series of silicon-carbide MOSFETs that it claims will allow manufacturers to shrink power systems while increasing their output, as demand rises for compact, high-density hardware used in AI servers and renewable-energy equipment.
The SCT40xxDLL family, announced in Willich-Münchheide, Germany, uses a TOLL, or TO-Leadless, package that the company says delivers roughly 39% better thermal performance than the conventional TO-263-7L format with comparable voltage ratings and on-resistance. The improvement is designed to support higher power handling without increasing component size, targeting applications such as server power supplies and energy-storage systems that are increasingly constrained by enclosure height.
Manufacturers of AI servers and slim photovoltaic inverters have been pushing for devices that combine higher power ratings with ever-smaller footprints. That pressure is particularly acute in totem-pole power-factor-correction circuits used in so-called pizza-box power supplies, where discrete components are often required to be less than 4mm thick.
ROHM’s new devices reduce the component footprint by about 26% and achieve a thickness of 2.3mm, roughly half that of the firm’s previous generation. They also extend the drain-source voltage capability of typical TOLL-package parts from 650V to 750V, providing additional surge-voltage margin, enabling lower gate resistance, and helping to cut switching losses.
The initial line-up includes six models with on-resistance values ranging from 13mΩ to 65mΩ, with volume production having begun in September 2025. The parts are available through major online distributors, including DigiKey, Mouser, and Farnell. ROHM has also released simulation models for all six products on its website to support design evaluation.
Target applications include industrial power supplies for AI servers, data centres, photovoltaic inverters, and energy-storage systems, as well as general consumer power supplies.
The devices are marketed under the EcoSiC brand, ROHM’s portfolio of silicon-carbide components. The company says it develops key SiC technologies in-house, from wafer processing to packaging and quality control, and operates an integrated production system aimed at securing its position as a leading supplier in the sector.
Founded in 1958, ROHM supplies semiconductor devices and electronic components for automotive, industrial, consumer, and communications markets through a global sales and development network. The company emphasises its strengths in analogue and power technologies, which it says allow it to offer system-level solutions combining SiC power devices with peripheral components and drive ICs.
