ASMPT has secured orders for 19 Chip-to-Substrate thermo-compression bonding tools from a major outsourced semiconductor assembly and test provider affiliated with one of the world’s leading foundries in the fast-expanding AI chip market.
The Singapore-headquartered group said today that it remains the sole supplier and Process of Record for these tools at the customer, which is ramping high-volume production of next-generation logic devices. The additional systems will support larger compound die sizes and more complex bonding requirements, underscoring what ASMPT described as sustained confidence in its technology and manufacturing capability.
Robin Ng, Group CEO, said the market for thermo-compression bonding was undergoing “transformational growth” as demand accelerates across artificial intelligence and high-performance computing. He added that ASMPT’s portfolio, spanning chip-on-wafer, chip-on-substrate, and high-bandwidth memory applications, positioned the company to meet increasingly demanding advanced-packaging roadmaps.
ASMPT claims the world’s largest installed base of such equipment, with more than 500 tools deployed. It expects to capture between 35% and 40% of an expanding market and has recently forecast that total addressable demand for thermo-compression bonding will exceed US$1 billion by 2027, supported by heavy investment across the AI ecosystem.
