Infineon Technologies, the German semiconductor group, will showcase a suite of quantum-safe advanced payment and identification technologies at TRUSTECH 2025 in Paris, as it seeks to capitalise on the growing demand for secure digital transactions. The event runs from 2 to 4 December at the Paris Expo Porte de Versailles.
The company’s highlights include the TEGRION SLC27 security controller, which has achieved Common Criteria EAL6+ certification with a post-quantum cryptography library, incorporating ML-KEM and ML-DSA algorithms. The device has been nominated for the TRUSTECH Innovation Award, reflecting industry recognition of its potential to protect against emerging quantum computing threats.
Infineon is also promoting its ID Key S USB and SECORA ID platforms, designed to unify hardware and software for secure identity management. The systems combine USB and NFC connectivity and support FIDO standards, allowing organisations to deploy flexible identity solutions. Live demonstrations will show how physical electronic ID credentials can work alongside mobile IDs, including a Multi-Trust Smartcard for healthcare applications resilient to network outages.
In payments, Infineon will present SECORA Pay M, which supports EMV, Tap-to-X, and FIDO authentication, and SECORA Pay Bio, enabling biometric contactless payments at scale. Its SECORA Pay Green module, which integrates a contactless antenna to reduce CO₂ emissions in card production by over 60%, has already been recognised with the 2024 TRUSTECH Innovation Award and added to Mastercard’s Card Eco Certification programme.
Visitors to the Infineon stand will also see a novel demonstration of a smart chip integrated into fingernails, allowing seamless contactless payments in collaboration with Smart Chip and Digiseq.
Thomas Michalski, Senior Director Product and Application Management, will discuss “Innovative payment cards with elevated security and premium tap-and-go experience” at the Innovation Stage on 2 December.
