Components of an electric circuit and it’s parasitic constituent

Electric circuits may contain energy storing components, capacitors and inductors. More over, the transistor itself contains capacitances in its structure. Regarding capacitors, let’s consider their time variable constituent: C(T)=εA(t)l(t), q(t)=Cv(t), i(t)=Cdv(t)dt.
A capacitor is characterised with:
memory , so v(t)=1Cti(t)dt,
energy storage , so WE(t)=Cv2(t)2,
An electric circuit can also contain components that reflect a magnetic field. So the magnetic field flux B(t)=μNi(t)l(t) and the magnetic flux density is Φ(t)=A(t)B(t) and the total magnetic flux linked to the coil λ(t)=NΦ(t). So the inductor is characterised with:
inductance L(t)=μN2A(t)l(t) flux λ(t)=Li(t),
voltage v(t)=Ldi(t)dt current i(t)=1Ltv(t)dt energy storage, so Wm(t)=LI2(t)2
A circuit can also contain transformers and two-terminal devices, consisting of a second coil around the inductor and its small-signal interpretation (Figure 1). 
Figure 1.
So the generated voltages for the coils are v1(t)N1=v2(t)N2.
Figure 2 depicts the simplified structure of the n-channel MOSFET.
Figure 2. The layer structure of the MOSFET, showing the parasitic gate capacitance.
When positive voltage is applied to the gate, the MOSFET will look like how it is presented in Figure 1, and the layer under the gate will work as a capacitor. Knowing the planar characteristics of a MOSFET, we can calculate its internal capacitor parameters.
A real MOSFET usually contains many capacitors inside. So the gate-source capacitance will be CGS=εLWd, here εd=COX. This model also gives us the possibility to use the SRC model of a MOSFET. Here the voltage between the source and the gate will be changed, the current flow will change: iG=COXLWdvGSdt, where L and W are the planar characteristics of the MOSFET internal capacitors. As was mentioned above, real MOSFET behaviour is more complex because of the internal capacitances in the MOSFET structure.
A closer look at the real capacitive structure of the MOSFET is depicted in Figure 3, involving parasitic capacitances.
Figure 3. Parasitic capacitance structure of the MOSFET.
The datasheets of different MOSFET manufacturers refer to the Ciss=Cgs+Cgd, Coss=Cgd+Cds, Crs=Cgd, which are input parasitic capacitance, output capacitance and reference capacitance, respectively.
The Ciss capacitance is the capacitance showing how much charge is needed for the MOSFET to start to be driven. The COSS is the output capacitance, characterising the turning off time for the MOSFET. The Crss is the reverse capacitance characterising the switching off time for the MOSFET.

Keep Up to Date with the Most Important News

By pressing the Subscribe button, you confirm that you have read and are agreeing to our Privacy Policy and Terms of Use
Previous Post

Moving towards level 5 autonomy

Next Post

Transition completed to ISO 13485 medical device accreditation