Power MOSFET switching characteristics

It is very important to understand switching characteristics of power MOSFET. To understand the turn-on and turn–off process in power MOSFETs, we have to consider the simplified equivalent circuits of the power MOSFET in turn-on and turn-off states. When the power MOSFET is off,

Vsource=0

,

VDS=VDD

and

ID=IG

. Let’s first consider turn-on processes among power MOSFET switching characteristics.

  1. t=t0, when the voltage

    VGGis applied, the gate source voltage starts to control the drain-source current, and the capacitor

    CGScharges through the resistor

    R.

  2. t0<t<t1, when the

    VGS<VTh, the transistor  is in the cut-off mode and

    iD=0.This time

    t=t1t0is needed to charge capacitor

    CGS, and this means delay in time before transistor will turn on. Capacitor

    CGScharges to the voltage level

    VTh. The gate current

    iG(t)=VsourceVGSR=iGS+iGD=CGSdiGSdtCGDd(vGvD)dt, here

    vGis gate-to-ground voltage,  and

    vDis a drain-to-ground voltage. And gate current

    iG(t)=(CGS+CGD)dvGSdt.Resolving these exponential equations we can show that

    vGS(t)=Vsource(1ett0τ), where

    τ=R(CGS+CGD), and gate current

    iG(t)=vsource Rett0τ,

    iD=0. Resistance

    rdsis characterising conducting state of power MOSFET.

  3. t=t1, then

    VGS(t1)=VThMOSFET start to conduct current. Delay time

    t10=t1t0=τln(1vThvGG).

  4. t>t1, and

    VGS>VTh, so the

    iDbecomes a function of

    vGSand

    VTh.

  5. t<t2, and

    VGS>VTh,

    iD raises exponentially  and is characterised by function

    iD(t)=k(vGSvTh), here is a coefficient, and

    iD<Io,

    vDS=VDD.

  6. t=t2, iD(t2)=Imaxthe drain turns off.  Resolving exponential equation we can obtain

    t21=τln(kVsourcek(VsourceVTh)Imax), vGS(t2)=Vsource, iG(t2)=0.

  7. t>t2, the drain is closed,

    iD(t)=Imax, vGS(t)=const.  From the equations above

    vGS=Imaxk+VTh.

  8. t2<t<t3, MOSFET turns off ,

    iD=Imax, capacitance

    CDSis discharging,

    vG=const, current flows through

    CGD.

  9. t>t3, iG  flows through capacitance

    CGD,

    vGS(t)=Vsource(1ett2τ), gate voltage raises until moment of time

    t=t3, when gate current

    iG=0and MOSFET is completely turned off. Time interval

    t32=RCGDVDDIDrDSvsourceVTh.

  10. Total delay when power MOSFET is on-state is
    ton=t32+t21+t10, there is a high current and voltage goes through the device during periods of time

    t21and

    t32, that provokes high power losses in MOSFET. Smaller resistance

    Rwill decrease power losses.

Figure 1. The equivalent circuit of turn-on process for a power MOSFET
Figure 1. The equivalent circuit of turn-on process for a power MOSFET
Figure 2. Time dependences of currents and voltages for turn-on process of power MOSFETs.
Figure 2. Time dependences of currents and voltages for turn-on process of power MOSFETs.

Now we know turn-on part of power MOSFET switching characteristics, so we can consider the turn-off part in the power MOSFET as well. We can assume that the device is on for

t>t0

.

  1. When
    t=t0, vDS(t0)=IDrDS,vGS(t0)=Vsource, iDS(t0)=Imax, iG(t0)=0. The equivalent circuit is depicted on figures 2-4. When

    vDS=const,

    CGSand

    CGDare discharging, gate-to-source voltage is

    vGS(t)=vGS(t0)ett0τ. Current through the capacitor

    CGDreaches the constant value

    iDS(t0)=Imax. So

    vGS(t0)=Imaxk+VTh.

  2. When
    t1<t<t2, iG(t)=VsourceRett0τ, vGS=const, so the current goes through the

    CGD,

    iG(t)=1R(Imaxk+VTh)ett2τ, vGS(t)=(Imaxk+VTh)ett2τ, iDS(t)=kVTh(ett2τ1)+Imaxtt2τ.

  3. When
    t2<t<t3, the drain current

    iD(t)becomes 0, and the service is turned off,

    vGS(t3)=VTh.

  4. When
    t<t3, the gate voltage continues to fall to 0, and the voltage function is exponential. The gate-to-drain capacitance

    CGDcharges to the

    VDDvalue.

  5. When
    t3<t<t4drain current

    IDdecreases to 0.

Figure 3. Equivalent scheme for turn–off MOSFET process.
Figure 3. Equivalent scheme for turn–off MOSFET process.

Figure 4. Time variations for currents and voltages for the turn-off process of power MOSFETs
Figure 4. Time variations for currents and voltages for the turn-off process of power MOSFETs

The extreme modess of power MOSFETs were explained above. As you can see it is very important to understand every switching characteristics of power MOSFET as MOSFETs are used a lot like switch devices. Let’s briefly consider the Safe Operating Area (SOA). The SOA provides the limits of the power MOSFET to work. Figure 3 depicts the SOA for one of the power MOSFETs from the Infineon product line.

Maximum current is determined by the maximum power dissipation of the MOSFET and follows the formula

Pdissipation=IDSR, IDS

and corresponds to the on-state of the power MOSFET. The drain-to-source voltage is growing. The MOSFET starts to work in the saturation mode. Here the device experiences big values of current and voltage. When the drain-to-source voltage grows further the device experiences the avalanche breakdown (it is indicated as the second breakdown limit). Digi-Key Electronics has a great selection power MOSFETs.

Figure 5. Safety Operating Area (SOA) of the Infineon OptiMOS power MOSFET series.
Figure 5. Safety Operating Area (SOA) of the Infineon OptiMOS power MOSFET series.

(«Power Electronics Handbook», 3rd edition, M.H. Rashid.; «Infineon OptiMOS Power MOSFET datasheet explanation», Infineon Technology AG.)

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