Essemtec, the Swiss manufacturer of adaptive SMT and dispensing solutions, announces a major performance upgrade to its Jet-on-the-Fly high speed solder paste jetting technology, now achieving 1.1 million dots per hour. This new milestone sets a benchmark for high-mix, low-to-mid volume production, redefining how manufacturers approach precision solder paste application.
Designed for flexibility, accuracy, and digital manufacturing efficiency, Essemtec’s solder paste jetting solution is available on all platforms – the Spider and Tarantula dispensing systems, and the FOX Ultra and PUMA Ultra all-in-one machines.
With Essemtec’s intelligent Gerber file import, users can move from digital design to production in no time, as recipes can be automatically prepared for any new project, eliminating manual programming and setup delays.
Two ways to use solder paste Jetting
Complement our stencil printer – For complex or selective applications
- Eliminate stepped stencil designs
- Apply solder exactly where needed
- Perfect for ultra-fine pitch and special components
Replace the stencil printer entirely – For a fully digital, stencil-free process
- No tooling, no cleaning, no delays
- Less waste, instant product changeover
- Ideal for high-mix SMT lines and prototype-to-production workflows
- Solder Paste application in cavities or different Z-levels seamlessly
Technical performance
The upgraded Jet-on-the-Fly system delivers up to 1.1 million dots per hour at peak frequency. In real production conditions, users can achieve an average of 350,000 dots per hour on typical boards and up to 665,000 dots per hour on dense BGA patterns. Each dot can be dispensed with volumes between 1.8 to 80nL, ensuring perfect repeatability and accuracy across every pad and component.
With jetting performance capable of feeding Pick & Place systems up to 50,000cph, Essemtec’s solder paste jetting technology offers unmatched process integration — from prototyping to full-scale production.
