Kurtz Ersa announces that Joseph Clure, Applications Engineer, will present a technical paper at SMTA International 2025 in Rosemont, Illinois. His presentation, ‘Improving Transfer of Thermal Energy During Selective Soldering Using Common Settings and Preparation/Tooling Choices,’ will take place during Session MFX1: Reliability Solutions on Tuesday, 21st October 2025 from 9-9:30am CDT.
Co-authored with David Miller of Kurtz Ersa and Thomas Shoaf of Plexus Neenah Operations, the paper examines how process settings and tooling choices influence thermal energy transfer during selective soldering. Drawing on a series of controlled experiments, the study highlights how adjustments to factors such as pin protrusion length, nozzle-to-PCB gap, and solder flow can significantly improve solder joint quality without relying solely on higher solder pot temperatures.
“With today’s complex PCB designs and high thermal mass assemblies, manufacturers are being challenged to achieve consistent vertical hole fill,” the authors stated. “Our research shows that by making use of parameters available on nearly all selective soldering systems, it’s possible to improve thermal transfer and solder joint reliability without compromising materials or throughput.”
The presentation builds on Kurtz Ersa’s long-standing expertise in selective soldering and advancing process knowledge for high-reliability manufacturing in automotive, aerospace, and industrial applications.
SMTA International will be held 20-23rd October, 2025, at the Donald E. Stephens Convention Center in Rosemont, Illinois.
