As a result of the growth of cloud-based services, particularly those enabling artificial intelligence (AI), data centres are now responsible for more than two percent of global energy consumption. This figure is expected to rise further, with exponential growth of 165% predicted between 2023 and 2030. Continuously improving efficiency, power density, and signal integrity of power conversion from the grid to the core is therefore critical to advancing computing performance while reducing total cost of ownership (TCO). To address this need, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching the OptiMOS TDM22545T dual-phase power module, the industry’s first trans-inductance voltage regulator (TLVR) module specifically designed for high-performance AI data centres.
The module’s proprietary TLVR inductance architecture minimises the number of output capacitors, reducing the overall size of the voltage regulator (VR) and significantly lowering material costs (bill of material; BOM).
“With the OptiMOS TDM22545T, we are continuing our innovation efforts to deliver benchmark power density and transient response for power modules that are critical for powering AI data centres,” says Rakesh Renganathan, Vice President Power ICs at Infineon. “By integrating a proprietary TLVR inductor with robust OptiMOS technology and thermally enhanced chip-embedded packaging, and by leveraging Infineon’s system expertise, we continue to accelerate green computing as part of our mission to drive digitalisation and decarbonisation.”
The OptiMOS TDM22545T module combines robust trench technology power stages with proprietary TLVR inductors. This results in excellent power density, improved electrical and thermal efficiency, and enhanced signal quality with reduced transients. The inductor design delivers an ultra-fast transient response to dynamic load changes caused by AI workloads without compromising electrical and thermal efficiency. This directly translates into increased computing throughput, a robust system design, and reduced TCO for AI data centres. The new module is also compatible with vertical power delivery (VPD) systems, where power delivery network (PDN) losses can be reduced up to 50% versus traditional top-side lateral designs. It supports up to 140A across both phases in a compact form factor of 9 x 10 x 5 mm³. Combined with Infineon’s XDP controllers, the AI power module family offers the industry’s most robust solution for powering AI data centre applications.
