Marvell Technology announces it will showcase its extensive interconnect portfolio for scale-up and scale-out data centre AI deployments at the European Conference on Optical Communication (ECOC), 28th September to 2nd October 2025 in Copenhagen, Denmark.
The rapid evolution of generative AI technologies and large-scale models is redefining data centre architectures, driving unprecedented demand for interconnect performance, bandwidth, and power efficiency. This transformation is accelerating the need for high-performance silicon, advanced memory architectures, and tightly integrated optical connectivity. As hyperscalers scale massive AI compute clusters across racks, campuses, and multi-site topologies, interconnect technologies must be developed to deliver efficiency, scalability, and workload-optimised performance.
Marvell is addressing this challenge with a full-stack approach – combining advanced silicon platforms, chiplet-based architectures, and breakthrough optical technologies. Together, these innovations unlock new levels of performance across scale-up and scale-out fabrics, reduce latency, lower power consumption, and enable faster deployment at cloud scale.
At ECOC 2025 (stand #C4134), Marvell will showcase technologies that will drive the next generation of AI interconnects, including:
Co-packaged Optics (CPO) for AI scale up: CPO platform supporting 200G/lane connectivity for energy-efficient, high-bandwidth links spanning multiple racks within an AI scale-up domain
Marvell COLORZ 800G ZR/ZR+ for multi-site AI training: industry-first family of 800Gbps ZR/ZR+ coherent pluggable optical modules. Supports transmission up to 2,000km, enabling cost-effective, scalable data centre interconnect (DCI) between geographically distributed AI clusters
200G/Lambda 1.6T PAM4 optical interconnect: Marvell Ara, the industry-first 3nm PAM4 DSP, combines eight 200Gbps channels inside a single optical module, enabling rapid deployment of AI scale-out fabrics across rows and data halls
Marvell experts will also deliver a number of presentations on interconnect technologies designed to scale accelerated infrastructure.
