StratEdge Corporation, will showcase its thermally efficient line of post-fired and moulded ceramic packages at two upcoming events: Booth 719 at the IMAPS International Symposium, 29th September to the 2nd October in San Diego, CA. Then at Booth 6 at the IEEE BCICTS, 13–14th October in Scottsdale, AZ.
StratEdge packages operate from DC to 63+GHz and efficiently dissipate heat from compound semiconductor devices such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC). These high-performance packages enable devices to meet the rigorous requirements of defence, satellite, test and measurement, automotive, and downhole applications.
“For decades, StratEdge has been a passionate supporter of IMAPS, and this year is no exception. Our team of experts looks forward to meeting attendees in person and discussing their high-frequency, high-reliability, and high-power packaging needs,” said Casey Krawiec, VP of Global Sales at StratEdge. “Our moulded ceramic packages provide outstanding solutions for space and defence applications and can be manufactured with thermally enhanced metal bases for superior heat dissipation. Our post-fired ceramic packages are recognised for electrical transition designs that minimise losses to an exceptional degree. We’ve been exhibiting at BCICTS and its predecessor symposiums since the early 1990s, and we remain a trusted supplier of premium packaging solutions for compound semiconductors. If we don’t see you in San Diego, we hope to connect in Scottsdale.”
