xMEMS Labs will unveil a next-generation headphone architecture at its annual xMEMS Live 2025 seminar series on 16th September in Taipei and 18th September in Shenzhen. This new architecture pairs Sycamore, the world’s first MEMS loudspeaker for headphones, with µCooling, the first air pump-on-a-chip, to deliver pristine audio and reduced moisture build-up in a lighter, thinner, and more comfortable headphone experience.
Replacing conventional 40-50mm dynamic coil drivers, the Sycamore MEMS loudspeaker introduces a solid-state alternative that is 98% smaller by volume (just 85mm³ vs. ~4,000mm³ for 50mm drivers) and weighs only 150mg. Despite its micro-scale size, Sycamore delivers full-range, high-fidelity audio performance while requiring only a 1cc back volume, freeing up space inside the earcup for larger batteries, advanced PCBs, and thinner industrial designs.
A single Sycamore-based speaker plate weighs just 18g, a dramatic reduction compared to ~42 grams for a conventional 50mm driver assembly. This 57% weight reduction allows for headphone designs that are dramatically lighter, reducing fatigue and improving comfort for all-day wear.
In parallel, xMEMS is applying its µCooling technology to headphones to deliver reportedly the world’s first silent, vibration-free, sensation-free active humidity control inside the earcup. By actively reducing moisture and maintaining optimal humidity, µCooling addresses a longstanding challenge in over-ear headphone design: heat and moisture buildup during extended listening sessions. The result is a cooler, dryer, and more enjoyable long-term wearing experience.
Early testing has demonstrated that µCooling can effectively regulate ambient humidity levels inside the earcup during extended use. In test cases where humidity was allowed to build up prior to activation, µCooling reduced humidity from 85% to ambient levels in under five minutes – a drop of 20% in relative humidity.
“Our MEMS-based architecture redefines what’s possible in headphone design,” said Yanchen Lu, VP of Systems Engineering, xMEMS Labs. “By combining Sycamore’s solid-state audio fidelity with µCooling’s advanced thermal and humidity management, we’re empowering manufacturers to move beyond conventional form factors – delivering thinner, lighter, and more expressive designs while maximizing sound quality and comfort. It’s a breakthrough that elevates both form and function, transforming the all-day listening experience.”
The debut of this next-generation headphone architecture reflects xMEMS’ continued innovation at the intersection of MEMS audio and micro-scale thermal management, extending the company’s expertise beyond earbuds and wearables into premium headphone categories.
Sycamore loudspeakers and µCooling devices are now available to select early access customers, with volume production targeted for the second half of 2026. Demonstrations will be available at xMEMS Live 2025 in Taipei and Shenzhen.
