Modern military and aerospace supply chain management is facing greater challenges than ever before. Systems require longer development times and have longer production lifecycles than any other industry, often excessing 30 years. However, the semiconductor manufacturing industry is driven by consumer applications with far shorter lifecycles, leading to end-of-life (EOL) announcements and a defocus on legacy devices.
Additionally, the rapid advancements in semiconductor technology have accelerated the rate of component obsolescence. When faced with EOL critical-parts manufacturers must find reliable replacements, which not only cover single-replacement events, but also the requirements of a programme’s full lifecycle.
The unique qualities of military and aerospace designs add challenges to finding viable solutions for obsolete components. Redesigns are an option, but often entail costly development, testing, and requalification. Working directly with the semiconductor suppliers may not be an option, as many suppliers are reluctant to allow access to intellectual property to those outside of their usual partners.
To support product transfer and licensed manufacturing of semiconductor components, Rochester Electronics has developed a state-of-the-art test and manufacturing facility at our headquarters in Newburyport, Massachusetts. Rochester can perform hermetic and plastic packaging, and complex hybrid assembly. In addition, Rochester has two US-based design centres with substantial silicon ASIC design experience, with a focus on original device replication and form-fit, functional drop-in product replacements.
Beyond providing long-term sourcing of obsolete devices, Rochester Electronics is successful in providing replicated alternatives that meet the exact performance specifications of the original device. These product replications differ from alternatives based on emulations, who attempt to mimic the functionality of the original device. Product replication includes working with the original component manufacturer (OCM) and is an exact physical and electrical duplicate with output edge-rate matching. The product’s pin-for-pin construction, identical die size, and matched cycle-for- cycle timing, mean the component is 100% guaranteed to perform identically as the original device.
Product qualification of a duplicated device is significantly less than any redesigned or emulated alternative. Rochester Electronics has a highly qualified design team with decades of experience and a deep knowledge of semiconductor technology. Rochester’s replicated product portfolio includes microprocessors, DSPs, microcontrollers, mixed-signal, and full digital or analog designs.
Aviation customers have partnered with Rochester to avoid the costly DO-254 recertification path by replicating devices that allow for simpler minor change classification. Rochester’s team has enabled customers to migrate FPGA, PLD, and other programmable solutions into sourceable products for the life of their product lines.
Rochester has over 30,000 square feet dedicated to semiconductor test and burn-in, which includes 16 major ATE platforms, and over 40 testers and component handlers. The mix of both modern and legacy platforms empowers Rochester to provide a migration path that ensures continuity of product supply for many years in the future.
While many vendors in the industry are phasing out lead frame packages, Rochester continues to invest in a range of options, such as QFNs, PLCCs, QFP, PDIPs, TSSOPs, and SOICs. We also support a wide range of standard hermetic assemblies. Full MIL-STD qualifications are completed within the Newburyport, Massachusetts facility. The reliability lab is certified by the Defence Logistics Agency to provide Group A, B, C, and D testing to military standards, including space level.
Rochester is currently providing 8×8 pin QFN package assembly for a defence programme incorporating a microcircuit module controller on a radar system. The end-product is currently undergoing the qualification process using Rochester’s package assemblies. The customer selected Rochester out of respect to our technical capability, flexibility in order quantities, and ability to provide additional manufacturing services.
Rochester Electronics is a reliable long-term US-based partner to the military and aerospace industries. For more than three decades we have been enabling product transfers and helping our customers avoid component obsolescence. We continue to invest in onshore design, manufacturing, and test services to ensure the continuity of supply of semiconductor products.
We are committed to providing our customers with a continuous source of supply and extending product lifecycles.
For more information visit – www.rocelec.com
Luke Fitzpatrick, Aerospace & Defence Director, EMEA, Rochester Electronics
This article originally appeared in the July’25 magazine issue of Electronic Specifier Design – see ES’s Magazine Archives for more featured publications.
