The 3M Thermally Conductive Adhesive Transfer Tapes offer excellent adhesive performance with good wetting and flow onto many substrate surfaces, providing excellent thermal conductivity and electrical insulation properties.
The 3M Thermally Conductive Silicone Interface Pads (TCSIP) consist of a highly conformable and slightly tacky silicone elastomer sheet filled with conductive ceramic particles that help to provide enhanced thermal conductivity and excellent electrical insulation performance.
3M Thermally Conductive Epoxy Adhesive, a two-part epoxy, uses a high-performance filler to ensure good thermal conductivity with high adhesion.
Finally, the thermally conductive acrylic interface pad is designed to provide a preferential heat transfer path between heat-generating components like IC chips or EV batteries and a heat spreader.
The specialised chemistry of all of these adhesive tapes and pads render them modestly soft, allowing them to conform well to non-flat substrates.
This ultimately provides strong adhesive properties and a superior thermal interface.
