Bill Vuono of TriQuint Semiconductor will chair Session 4 ‘Bottom Termination Components’.
Dale Lee and Dr. Ning Chen Lee, both from Plexus, will present on ‘Design Rules that Reduce Flux Pooling under Component Terminations’ and ‘The Risk of No-Clean Flux not Fully Reacted under Component Terminations’, respectively.
Alongside Linda Woody of Lockheed Martin and Dale Lee of Plexus, Dr. Mike Bixenman of Kyzen will present on ‘Minimum electrical spacing for no-clean flux residue vs cleaned boards (voltage leakage or electro-chemical migration)’.