Compliant with the latest e-MMC and JEDEC standards, the memory devices integrate a controller to manage basic control functions for NAND applications. The e-MMC device interface handles essential functions such as writing block management, error correction and driver software. The memory products operate over a temperature range from -25 to +85°C and provide additional features such as BKOPS control, Cache Barrier, Cache Flushing Report and Large RPMB Write.
Compared to previous products from Toshiba, the e-MMC NAND chips offer faster read/write performance. Thanks to improvements in basic chip performance and controller optimisation, the devices offer 8% faster read speeds and 20% faster write speeds. Simplifying system design, the integrated design allows manufacturers to minimise development costs and shorten time-to-market.
The 16GB e-MMC NAND chips are available in 11.5×13.0x0.8, 11.0×10.0x1.0 and 11.5×13.0x0.8mm package sizes; while the 8, 32 and 64GB devices are also available in 11.5×14.0 and 11.0×10.0mm packages The 128GB device can record up to 16.3 hours of full spec HD video and 39.7 hours of SD video in an 11.5×13.0x0.8mm package.
Fabricated using Toshiba’s cutting-edge 15nm process technology, the 153-ball FBGA package is approximately 26% smaller than comparable Toshiba products. This package is particularly suited for use in smartphones, tablet PCs and wearable devices requiring miniaturisation and weight savings.