The NanoSlic stencil was developed to address the increasing demands confronting the electronic assembly industry. It enables higher yields and less rework by improving solder paste transfer efficiencies for small apertures. The stencil also minimises bridging and reduces underside cleaning. As well as this, the technology can be easily evaluated and is compatible with current assembly equipment and processes.
FCT’s solder pastes are formulated to solve various issues during the assembly process, including anti-tombstoning, low graping, low voiding, low melting, high activity, etc. Representatives will be available at the Expos to discuss solutions that the company can offer by leveraging its team’s vast knowledge and expertise in solder and stencils.