Photorelays provide design engineers with fast switching speed, high reliability, lower power consumption and noise-free operation in a space-saving package, making them an alternative to mechanical relays. Consisting of a photo MOSFET optically coupled to an infrared light emitting diode, the photorelay utilises the latest generation trench MOSFET to realise an approximately 1.4 times higher on-state current than Toshiba’s existing product, the TLP3103.
Featuring low on-state resistance and high permissible on-state current, the TLP3107 will accelerate the replacement of mechanical relays in applications that require high density assembly. Replacing a 3A-capable DIP package with the 2.54SOP6 package reduces the assembly area by 40%, and the overall product height by half.
Other features include trigger LED current 3mA (maximum); off-state output terminal voltage 60V (minimum); and isolation voltage 1500Vrms (minimum).