Typically occuring when one solder paste deposit reflows before the other, tombstoning occurs when components lift up during reflow causing an open pad at one end. Creating a temperature difference from end-to-end of the component during reflow, tombstoning is commonly found on circuit boards that have a ground plane attached to one end of a small component
FCT’s anti-tombstoning solder pastes are designed for use when it is difficult to change the reflow profile. FCT achieves anti-tombstoning properties through modification of the alloy to introduce a melting range which equalizes wetting forces, and therefore preventing small components from tombstoning. The pastes feature excellent performance when tombstoning is a concern and excellent wetting characteristics on all surface finishes, including OSP, Ni/Au, Ni/Pd/Au, Sn and Ag. Additionally, the pastes are available in no-clean and water soluble as well as lead-free and leaded formulations.