Test Interface Boards – Multitest Meets Today’s Fine-Pitch Requirements

Multitest announces that the Santa Clara board fab has refined its pulse plating process to integrate it into Multitest’s fabrication process to further enhance the high aspect ratio capability. The integration is a result of the Santa Clara board fab anticipating the market trend for chip scale packages, particularly for fine-pitch array packages such as BGAs or LGAs.

Leveraging the advantages of its continually refined manufacturing process, Multitest now is able to build 0.3 mm through-hole constructions and boards with even higher layer count for high pin count, 0.4 mm fine-pitch array applications.

Multitest is known for leading drilling and registration competence. The company continues to invest in high aspect ratio via capabilities to continuously enhance the fine-pitch product offering.

Keep Up to Date with the Most Important News

By pressing the Subscribe button, you confirm that you have read and are agreeing to our Privacy Policy and Terms of Use
Previous Post

Schaefer Announces High Density 3000W DC/AC Inverter Ideal for Rail, Military, and Industrial Applications

Next Post

Automotive Ethernet Put into Practice by MOST150