Under stencil wiping has gained an increase in interest over the last several years. Changes in circuit designs such as miniaturized components, increased density of components, and new stencil technology as well as changes in and increased attention to employee safety and environmental regulations have driven the renewed interest. New under stencil wipe solvents have been introduced recently to address these issues. However, little-to-no quantitative data exists explaining how these new solvents benefit the printing process, specifically, the yield, print volumes, and transfer efficiency. This lack of data has led to slow adoption of these solvents, as there is no proof that the costs justify their benefits. This paper quantitatively examines the effect of various combinations of solvents, wiping frequency, and pastes in a way that is relevant to both process engineers and the bottom line.
Lober joined Kyzen in 2010 as a process chemist, recruited for his Bachelor of Science in Chemistry at Rensselaer Polytechnic Institute in Troy, New York. David actively researches the effects of various cleaning agents to develop analytical testing methods that control precision cleaning processes. In Kyzen’s Analytical Lab, David oversees Kyzen’s Ion Chromatography program, both in operating the IC equipment and in analysis of results. Additionally, David collaborates with other Kyzen industry leaders to author publications and patents for Kyzen.
