COM Express Modules Take the Heat

Diamond Systems launched a family of COM Express 1.0 compliant computer-on-modules (COMs) based on Intel’s low-power, high-performance Atom and Core processors. Rated for operation over enhanced (-20o to +71o C) and extended (-40o to +85o C) temperature ranges, the modules are well suited to a broad range of fixed and mobile applications in the defense, avionics, transportation, energy management, and industrial automation sectors.

Diamond Systems launched a family of COM Express 1.0 compliant computer-on-modules (COMs) based on Intel’s low-power, high-performance Atom and Core processors. Rated for operation over enhanced (-20o to +71o C) and extended (-40o to +85o C) temperature ranges, the modules are well suited to a broad range of fixed and mobile applications in the defense, avionics, transportation, energy management, and industrial automation sectors.

Within the industry-standard 3.7 x 4.9-inch (95 x 125 mm) COM Express footprint, the CME-Atom and CME-965 each integrate a high-performance, low-power Intel processor, DDR2 SDRAM, and a complete set of PC-compatible system controllers and interfaces. Both modules provide eight USB 2.0 ports, a gigabit Ethernet LAN interface, high-resolution VGA CRT and LVDS LCD video, audio in and out, and mass storage interfaces. Additionally, both provide PCI Express, 32-bit PCI, and LPC expansion bus signals for connection to external generic or application-specific baseboards.

Supported operating systems currently include Windows XP and Linux 2.6, with support for additional OSes and RTOSes (real-time OSes) available on request.

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