“Over the last several decades semiconductors and circuit boards have changed dramatically, while the basic test methods for much of the industry have only made incremental improvements over the last 20 years. Now we’re seeing a paradigm shift in test,” said Glenn Woppman, president and CEO of ASSET. “Chips and boards have gotten smaller, denser and much more complex. Advanced technologies have moved beyond the reach of legacy, probe-based test methods like in-circuit test. The consequence of less test coverage is declining quality, reliability and durability, which triggers higher product returns and increasing warranty costs. The non-intrusive methods described in this white paper can return to manufacturers the test coverage they’ve lost as technology has advanced.”
The new white paper is titled “Solving the problem of diminishing test coverage from in-circuit test (ICT)” by Adam Ley, chief technologist of non-intrusive board test for ASSET.
