Kromax will represent Alchimer’s total through-silicon via (TSV) solution in Taiwan, including its Electrografting (eG) wet deposition technology. Electrografting is Alchimer’s breakthrough electrochemical process that enables the growth of extremely high-quality nanometric films for TSVs, semiconductor interconnects, MEMS and other electronic applications.
“This is further recognition in one of the most important chip-producing markets that Alchimer’s mature technology is recognized as a cost-effective solution for high aspect ratio TSVs, and we are pleased to announce this expansion of sales and service for our Taiwanese customers,” said Steve Lerner, Alchimer CEO. “Kromax’s history of operations in Taiwan and the rest of Asia, its strong relationships with Alchimer’s customers, and its excellentreputation for bringing breakthrough technologies to the market make it a very good fit for Alchimer.”
“Kromax is pleased to add Alchimer to our portfolio of leading tool and materials companies serving the IC and flat-panel markets,” said Kell Hwang, chairman of Kromax. “The company’s wet-deposition process has been solidly demonstrated as a leading solution for cost-effective, conformal high-aspect ratio TSVs.”
Alchimer’s expansion in Taiwan follows closely on the revenue success it has had in both South Korea and Japan, where it also has agreements with regional firms.