Fairchild’s 200V device, the FDMC2610, boasts the industry’s lowest Miller charge (3.6nC vs. 4nC) and the lowest on-resistance (200mOhms vs. 240mOhms) when compared with similar 200V MLP 3×3 devices on the market. These characteristics result in a 27 percent better Figure of Merit (FOM) and translate into superior thermal and switching performance in DC/DC converter applications. The 200V device also offers best-in-class thermal resistance (Theta JC) compared with similarly packaged devices (3C/W vs. 25C/W), a heat-dissipating feature that ensures reliability even in demanding environments.
“Fairchild now offers designers ultra-compact MLP 3×3 power switches with industry-leading performance,” said Mike Speed, Fairchild’s market development manager, communications. “We’ve combined the advantages of our PowerTrench® process and advanced packaging technology to enhance Fairchild’s UltraFET portfolio. These products are especially tailored to meet demanding design challenges posed by today’s DC/DC converter applications.”
In addition to offering superior thermal and switching performance over similarly packaged MLP devices on the market, Fairchild’s UltraFET devices consume 50 percent less board space than SO-8-packaged devices typically used in DC/DC converter designs. This package-size reduction enables engineers to design smaller, higher-density DC/DC converters by reducing the MOSFET footprint area and enhancing package thermal capability.
To complement this offering of three N-channel devices, Fairchild also introduces a 150V P-channel planar UltraFET device, which is also available in an MLP 3×3. This device option offers designers a complete solution for their active-clamp switch topologies requiring both N- and P-channel MOSFETs.
These lead (Pb)-free devices meet or exceed the requirements of the joint IPC/JEDEC standard J-STD-020C and are compliant with European Union regulations now in effect.
